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The Dieline Conference at HOW Design Live, April 30 – May 3 in Boston, to Explore the Future of Package Design and Branding
Four-Day Conference Features Some of the Most Influential Brands and Package Designers from Across the Globe; Event Coincides with One of the Biggest Design Events in the World
NEW YORK (Dec. 21, 2017) — The Dieline Conference (which takes place with HOW Design Live featuring HOW Marketing Live), will take place April 30 – May 3, 2018 at the Hynes Convention Center in Boston, Mass. The event, now in its ninth year and produced by HOW Design Live, is the most influential and comprehensive package design and branding conference, serving as a focal point for designers who work on consumer brands. HOW Design Live is the most inspiring, educational and talked-about design event anywhere in the world. Registration for both events is now open at howdesignlive.com (attendees can get the best price on a Big Ticket if they register by Feb. 1).
Andrew Gibbs, the founder of The Dieline Conference and founder, CEO and editor-in-chief of The Dieline, says, “The Dieline Conference is the go-to event for the packaging industry, whether you design packaging or branding for consumer products or work in the realm of consumer products. This year’s conference will explore the evolution and future of brand experience. We have arrived at a moment where everything is changing, yet everything and anything is possible. The conference will show you how to embrace not only what’s coming around the corner, but what might already be here.”
The Dieline Conference features a lineup of international design experts from some of the world’s top brands and agencies. Speakers represent: Instagram, Target, The Coca-Cola Company, The Hershey Company, Chobani, A Plastic Planet, Anagrama, ESTABLISHED, FutureBrand, IDEO Cambridge, Jones Knowles Ritchie, NINE, OKFocus, Package Free Shop, Pearlfisher, Red Antler, Rice Creative, Silas Amos, LTD and Space Doctors, among others.
Attendees will learn: how to maximize the power of smart package design for today's consumer; how digital printing is revolutionizing packaging; how online shopping gives new freedom and opportunities to brands by not designing packaging for retail; how to embrace the future of sustainable package design; how private label brands are thriving; the new generation of in-house design; and how new packaging technologies are enabling innovative brand experiences.
Gibbs says, “Packaging is no longer just about setting yourself apart on the shelf, it’s now a medium for brands to boldly stand out in our social media feeds, and create unique brand experiences. At The Dieline Conference, we’ll look to the future of packaging – which is now – and what’s next.”
Since its inception, The Dieline Conference, has been produced and co-located at HOW Design Live –global happening with more than 4,000 attendees from every U.S. state and from countries all around the world. In addition to The Dieline Conference sessions, attendees can participate in all of HOW Design Live's programming, including keynotes, sessions and the expo hall.
Visit http://howdesignlive.com to learn more and to register (attendees can get the best price on a Big Ticket if they register by Feb. 1). And be sure to follow HOW on social media at: @HOWEvent (Facebook), @HOWEvents (Twitter), @how_events (Instagram) or via #HOWLive.
About Emerald Expositions
HOW Design Live is owned by Emerald Expositions, the largest operator of business-to-business trade shows in the United States, with most of our shows dating back several decades. We currently operate more than 50 trade shows, including 31 of the top 250 trade shows in the country as ranked by TSNN, as well as numerous other events. Our events connect over 500,000 global attendees and exhibitors and occupy more than 6.9 million NSF of exhibition space. We have been recognized with many awards and accolades that reflect our industry leadership as well as the importance of our shows to the exhibitors and attendees we serve. https://www.emeraldexpositions.com
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Note to Editors: Press passes, artwork, interviews may be requested.